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<\/span><\/figcaption><\/figure>NEW DELHI: Taiwanese fabless chipmaker MediaTek<\/a> on Tuesday launched the Dimensity 9200<\/a> chipset<\/a>, based on Taiwan Semiconductor Manufacturing Company<\/a> (TSMC<\/a>)’s 4nm process with support for mmWave 5G, sub-6GHz, and W-Fi 7 connectivity.

MediaTek in a statement said that the Dimensity 9200 chipset will become available in smartphones<\/a> from 2022-end.

The chipset has a 1xArm Cortex-X3 at 3.05GHz, 3xArm Cortex-A715 at 2.85GHz, and 4xArm Cortex-A510 at 1.8GHz. This is paired with the Arm Immortalis-G715 GPU with hardware-based ray tracing.

“With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit at MediaTek.

Additionally, MediaTek said the Dimensity 9200 is the first Wi-Fi 7 ready platform, supporting up to 6.5 Gbps data rates. Its 5G modem integrates artificial intelligence (AI) for faster network searching, 5G connection<\/a> recovery out of dead zones, and other intelligent connectivity enhancements.

The chipset further supports switching between sub-6GHz and mmWave connections simultaneously. The Dimensity 9200 also allows Wi-Fi, Bluetooth low energy (LE) audio and wireless peripherals like gamepads to connect at the same time without interference.

“Device makers can use MediaTek’s Dimensity Open Resource Architecture (DORA) program to customize the Dimensity 9200 features for local markets, customer needs and smartphone requirements,” the company said.

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智能手机Dimensity 9200 5 g芯片推出在2022年结束:联发科

”,尤其是亮图像捕捉和改进游戏的速度,以及最新的显示增强,9200年Dimensity将带来新的可能性为下一代智能手机的各种时尚和可折叠的形式因素,“JC Hsu说,公司副总裁和总经理的联发科在联发科的无线通信业务单元。

  • 2022年11月8日更新是05:18点
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新德里:台湾专业芯片制造商联发科周二推出了Dimensity 9200 芯片组基于台湾半导体制造公司(台积电)4海里过程支持mmWave 5 g, sub-6GHz,和fi网路7连接。

联发科在一份声明中说,Dimensity 9200芯片组将变得可用智能手机从2022年开始——结束。

芯片有1 xarm Cortex-X3在3.05 ghz, 3 xarm Cortex-A715在2.85 ghz,和4 xarm Cortex-A510 1.8 ghz。这是基于硬件的搭配手臂Immortalis-G715 GPU射线跟踪。

”,尤其是亮图像捕捉和改进游戏的速度,以及最新的显示增强,9200年Dimensity将带来新的可能性为下一代智能手机的各种时尚和可折叠的形式因素,“JC Hsu说,公司副总裁和总经理的联发科在联发科的无线通信业务单元。

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此外,联发科说,Dimensity 9200是第一个wi - fi 7好平台,支持6.5 Gbps数据率。其5 g现代集成人工智能(AI)更快的网络搜索,5 g连接复苏的死区,和其他智能连接增强。

芯片组进一步支持切换sub-6GHz和mmWave同时连接。9200还允许Dimensity wi - fi、蓝牙低能量(LE)音频和无线外设像游戏手柄连接在同一时间没有干扰。

“设备制造商可以使用联发科的Dimensity开放资源架构(多拉)项目定制Dimensity 9200当地市场的特点、客户需求和智能手机的需求,”该公司表示。

  • 发布于2022年11月8日下午05:11坚持
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  • 智能手机Dimensity 9200 5 g芯片推出在2022年结束:联发科

\"\"
<\/span><\/figcaption><\/figure>NEW DELHI: Taiwanese fabless chipmaker MediaTek<\/a> on Tuesday launched the Dimensity 9200<\/a> chipset<\/a>, based on Taiwan Semiconductor Manufacturing Company<\/a> (TSMC<\/a>)’s 4nm process with support for mmWave 5G, sub-6GHz, and W-Fi 7 connectivity.

MediaTek in a statement said that the Dimensity 9200 chipset will become available in smartphones<\/a> from 2022-end.

The chipset has a 1xArm Cortex-X3 at 3.05GHz, 3xArm Cortex-A715 at 2.85GHz, and 4xArm Cortex-A510 at 1.8GHz. This is paired with the Arm Immortalis-G715 GPU with hardware-based ray tracing.

“With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s wireless communications business unit at MediaTek.

Additionally, MediaTek said the Dimensity 9200 is the first Wi-Fi 7 ready platform, supporting up to 6.5 Gbps data rates. Its 5G modem integrates artificial intelligence (AI) for faster network searching, 5G connection<\/a> recovery out of dead zones, and other intelligent connectivity enhancements.

The chipset further supports switching between sub-6GHz and mmWave connections simultaneously. The Dimensity 9200 also allows Wi-Fi, Bluetooth low energy (LE) audio and wireless peripherals like gamepads to connect at the same time without interference.

“Device makers can use MediaTek’s Dimensity Open Resource Architecture (DORA) program to customize the Dimensity 9200 features for local markets, customer needs and smartphone requirements,” the company said.

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