$\"\"$ Barcelona: Qualcomm<\/a> Incorporated on Tuesday introduced the new Snapdragon<\/a> 700 Mobile Platform series for the high-tier mobile segment. The series features and performance previously only available in the premium Snapdragon 800 Mobile Platform series. The commercial sampling of the series is expected in first half of 2018.
\n
The company said that the series is aimed at bringing premium tech in more affordable devices. \"This is something our global OEM<\/a> customers and consumers are demanding,\" Qualcomm's president Cristiano Amon said.
\n
\nThe latest series is aimed China and emerging markets like India.
\n
The 700 Series will include on-device AI<\/a> supported by the Qualcomm Artificial Intelligence (AI) Engine, and improvements to the camera, device performance and power, supported by the heterogeneous compute power of premium features including the Qualcomm Spectra ISP, Qualcomm Kryo CPU, Qualcomm Hexagon Vector Processor and Qualcomm Adreno Visual Processing subsystem.
\n
\nThe chipmaker has also launched 5G Module Solutions to support original equipment manufacturers (OEMs) looking to capitalize on 5G technologies with an easy path to commercialize 5G in smartphones and major verticals quickly.
\n
\nQualcomm Technologies said that it aims to simplify end device designs, lowers total cost of ownership and support faster time to commercialization to ultimately accelerate new OEM entrants’ ability to adopt 5G in their systems by aggregating the most fundamental components of 5G into simple modules.
\n
(The reporter is in Barcelona to cover the Mobile World Congress<\/a> at the invitation of Qualcomm.)<\/body>","next_sibling":[{"msid":63093648,"title":"MWC2018: ZTE expects 20% growth in India revenue; to hire over 200 engineers for new tech lab and 5G testbed","entity_type":"ARTICLE","link":"\/news\/zte-expects-20-growth-in-india-revenue-to-hire-over-200-engineers-for-new-tech-lab-and-5g-testbed\/63093648","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":63096513,"entity_type":"ARTICLE","title":"MWC2018: Qualcomm launches Snapdragon 700 Mobile Platform series; 5G module solutions for OEMs","synopsis":"The company said that the series is aimed at bringing premium tech in more affordable devices","titleseo":"telecomnews\/mwc2018-qualcomm-launches-snapdragon-700-mobile-platform-series-5g-module-solutions-for-oems","status":"ACTIVE","authors":[{"author_name":"Danish Khan","author_link":"\/author\/479206691\/danish-khan","author_image":"https:\/\/etimg.etb2bimg.com\/authorthumb\/479206691.cms?width=100&height=100&hid=268","author_additional":{"thumbsize":true,"msid":479206691,"author_name":"Danish Khan","author_seo_name":"danish-khan","designation":"Senior Assistant Editor","agency":false}}],"Alttitle":{"minfo":""},"artag":"ETTelecom","artdate":"2018-02-27 17:10:06","lastupd":"2018-02-27 17:15:46","breadcrumbTags":["Qualcomm","OEM","snapdragon","AI","MWC2018","mobile world congress"],"secinfo":{"seolocation":"telecomnews\/mwc2018-qualcomm-launches-snapdragon-700-mobile-platform-series-5g-module-solutions-for-oems"}}" data-authors="[" danish khan"]" data-category-name="" data-category_id="" data-date="2018-02-27" data-index="article_1">

MWC2018:高通Snapdragon发射700移动平台系列;5 g为oem模块解决方案

该公司表示,该系列旨在让高端科技更负担得起的设备

2018年2月27日更新是05:15点

巴塞罗那:高通周二介绍了新的整合金鱼草700移动平台系列high-tier移动部分。系列特性和性能之前只有800年保险费Snapdragon移动平台系列。的商业抽样系列预计将在2018年上半年。

该公司表示,该系列旨在让高端科技更负担得起的设备。“这是我们的全球OEM客户和消费者要求,“高通总统克里斯蒂亚说。

最新系列的目的是中国和印度等新兴市场。

700系列包括设备上人工智能高通支持的人工智能(AI)引擎,相机和改进,设备性能和力量,支持异构计算能力的高级功能包括高通光谱ISP,高通Kryo CPU、高通六角向量处理器和高通促视觉处理子系统。

芯片制造商也推出了5 g模块解决方案支持原始设备制造商(oem)寻求利用5 g技术与一个简单的商业化之路5 g智能手机和主要垂直迅速。

高通技术说,它的目标是简化终端设备的设计,降低总拥有成本和支持更快的商业化最终时间加速新的OEM参赛者采用5 g的能力在他们的系统中通过聚合5 g为简单的最基本的组件模块。

(记者是覆盖在巴塞罗那全球移动大会高通的邀请)。

发布于2018年2月27日下午05:10坚持

$\"\"$ Barcelona: Qualcomm<\/a> Incorporated on Tuesday introduced the new Snapdragon<\/a> 700 Mobile Platform series for the high-tier mobile segment. The series features and performance previously only available in the premium Snapdragon 800 Mobile Platform series. The commercial sampling of the series is expected in first half of 2018.
\n
The company said that the series is aimed at bringing premium tech in more affordable devices. \"This is something our global OEM<\/a> customers and consumers are demanding,\" Qualcomm's president Cristiano Amon said.
\n
\nThe latest series is aimed China and emerging markets like India.
\n
The 700 Series will include on-device AI<\/a> supported by the Qualcomm Artificial Intelligence (AI) Engine, and improvements to the camera, device performance and power, supported by the heterogeneous compute power of premium features including the Qualcomm Spectra ISP, Qualcomm Kryo CPU, Qualcomm Hexagon Vector Processor and Qualcomm Adreno Visual Processing subsystem.
\n
\nThe chipmaker has also launched 5G Module Solutions to support original equipment manufacturers (OEMs) looking to capitalize on 5G technologies with an easy path to commercialize 5G in smartphones and major verticals quickly.
\n
\nQualcomm Technologies said that it aims to simplify end device designs, lowers total cost of ownership and support faster time to commercialization to ultimately accelerate new OEM entrants’ ability to adopt 5G in their systems by aggregating the most fundamental components of 5G into simple modules.
\n
(The reporter is in Barcelona to cover the Mobile World Congress<\/a> at the invitation of Qualcomm.)<\/body>","next_sibling":[{"msid":63093648,"title":"MWC2018: ZTE expects 20% growth in India revenue; to hire over 200 engineers for new tech lab and 5G testbed","entity_type":"ARTICLE","link":"\/news\/zte-expects-20-growth-in-india-revenue-to-hire-over-200-engineers-for-new-tech-lab-and-5g-testbed\/63093648","category_name":null,"category_name_seo":"telecomnews"}],"related_content":[],"msid":63096513,"entity_type":"ARTICLE","title":"MWC2018: Qualcomm launches Snapdragon 700 Mobile Platform series; 5G module solutions for OEMs","synopsis":"The company said that the series is aimed at bringing premium tech in more affordable devices","titleseo":"telecomnews\/mwc2018-qualcomm-launches-snapdragon-700-mobile-platform-series-5g-module-solutions-for-oems","status":"ACTIVE","authors":[{"author_name":"Danish Khan","author_link":"\/author\/479206691\/danish-khan","author_image":"https:\/\/etimg.etb2bimg.com\/authorthumb\/479206691.cms?width=100&height=100&hid=268","author_additional":{"thumbsize":true,"msid":479206691,"author_name":"Danish Khan","author_seo_name":"danish-khan","designation":"Senior Assistant Editor","agency":false}}],"Alttitle":{"minfo":""},"artag":"ETTelecom","artdate":"2018-02-27 17:10:06","lastupd":"2018-02-27 17:15:46","breadcrumbTags":["Qualcomm","OEM","snapdragon","AI","MWC2018","mobile world congress"],"secinfo":{"seolocation":"telecomnews\/mwc2018-qualcomm-launches-snapdragon-700-mobile-platform-series-5g-module-solutions-for-oems"}}" data-news_link="//www.iser-br.com/news/mwc2018-qualcomm-launches-snapdragon-700-mobile-platform-series-5g-module-solutions-for-oems/63096513">

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MWC2018:高通Snapdragon发射700移动平台系列;5 g为oem模块解决方案

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