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联发科Dimensity 900 5 g芯片组中间层智能手机从2温度系数

octa-core 5 g芯片包含两个手臂Cortex-A78处理器时钟速度高达2.4 ghz和六臂Cortex-A55核心操作在2 ghz,虽然手臂Mali-G68 MC4图形处理单元(GPU)的图形处理设备的需求。

联发科Dimensity 900 5 g芯片组中间层智能手机从2温度系数
新德里:台湾专业芯片制造商联发科周四表示,其新6 nm-based5克Dimensity 900芯片组将电力市场设备从2开始对方篮里。

octa-core 5 g芯片包含两个手臂Cortex-A78处理器时钟速度高达2.4 ghz和六臂Cortex-A55核心操作在2 ghz,虽然手臂Mali-G68 MC4图形处理单元(GPU)的图形处理设备的需求。

此外,联发科的第三代人工智能处理单元支持各种各样的人工智能应用程序和4 k高清分辨率(HDR)。

的连通性,Dimensity 900芯片组集成5 g的新收音机(NR) sub-6GHz调制解调器载波聚合和支持高达120 mhz带宽。它还支持wi - fi 6连接。

芯片进一步支持每连接一代从2 g到5 g,以及5 g独立(SA)和non-standalone (NSA)架构,5 g两种载波聚合(2 cc)在频分双工(FDD),时分双工(TDD),动态频谱共享(DSS),真正的双卡5克(5 g SA + 5 g SA)和新的语音广播(VoNR)。

Features-wise,它可以支持120 hz全高清+显示,108 mp主要相机32 m 30 fps,和多幅相机选项如20 + 20像素。

读也

智能手机由联发科Dimensity 1200、1100 5 g芯片推出2温度系数

联发科700 5 g芯片组Realme智能手机在2021年推出

INT8芯片组集成人工智能处理单元,INT16和FP16功能提供精确AI-camera结果。

视频录制和回放,芯片集成了一个HDR-native图像信号处理器(ISP)和集成了一个硬件加速4 k HDR录像引擎,并可以升级标准的动态范围(SDR)内容与实时增强HDR HDR10 +视频回放。

“Dimensity 900带来一套连接,显示和4 k HDR视觉增强中间层5 g智能手机和伟大的设计灵活性给品牌的5 g的投资组合,“JC Hsu说,通用汽车公司副总裁和联发科的无线通信业务单元。

芯片组的支持5 g和wi - fi 6确保用户得到最多的设备与超高速和可靠的连接,”徐说。

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\"MediaTek<\/figure>NEW DELHI: Taiwanese fabless chip maker MediaTek<\/a> Thursday said its new 6nm-based 5G<\/a> Dimensity 900 chipset will power mass-market devices<\/a> from 2Q21 onwards.

The octa-core 5G chipset consists of two Arm Cortex-A78 processors with a clock speed of up to 2.4GHz and six Arm Cortex-A55 cores operating at 2GHz, while the Arm Mali-G68 MC4 graphics processing unit (GPU) handles the graphic processing needs of the device.

Additionally, the third generation of MediaTek\u2019s AI processing unit supports a wide variety of AI applications and 4K high definition resolution (HDR).

<\/div><\/div>In terms of connectivity, the Dimensity 900 chipset is integrated with a 5G New Radio (NR) sub-6GHz modem with carrier aggregation and support for bandwidth up to 120MHz. It also supports Wi-Fi 6 connectivity.

The chip further supports every connectivity generation from 2G to 5G, as well as 5G standalone (SA) and non-standalone (NSA) architectures, 5G two carrier aggregation (2CC) across frequency division duplex (FDD), time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR).

Features-wise, it can support 120Hz Full-HD+ displays, 108MP main camera with 32M at 30fps, and multi-camera options such as 20+20MP.

Read also<\/h3>
<\/a><\/div>

Smartphones powered by MediaTek Dimensity 1200, 1100 5G chipsets to launch in 2Q21<\/h4><\/a><\/div>
<\/a><\/div>

MediaTek 700 5G chipset-powered Realme smartphone to be launched in 2021<\/h4><\/a><\/div><\/div>
The chipset integrates an AI processing unit with INT8, INT16, and FP16 capabilities to deliver precise AI-camera results.

In terms of video recording and playback, the chipset integrates an HDR-native image signal processor (ISP) and incorporates a hardware-accelerated 4K HDR video recording engine, and can upgrade standard dynamic range (SDR) content to HDR with real-time enhancements of HDR10+ video playback.

<\/div><\/div>\u201cDimensity 900 brings a suite of connectivity, display and 4K HDR visual enhancements to mid-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios,\u201d said JC Hsu, Corporate VP and GM of MediaTek's Wireless Communications Business Unit.

\u201cThe chipset\u2019s support for 5G and Wi-Fi 6 ensures users get the most out of their devices with super-fast and reliable connectivity,\u201d Hsu added.
<\/div><\/div>
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